RF360
Original Website: https://rffe.qualcomm.com/
Qualcomm RF360, formerly EPCOS, is headquartered in Munich, Germany. On October 1, 2009, EPCOS merged with TDK's component business unit. In 2016, Qualcomm acquired all products of the SAW part and established a joint venture with TDK: RF360, in which Qualcomm holds a 51% stake. RF360 is dedicated to driving innovation in radio frequency front-end (RFFE) technology globally for mobile devices and applications in IoT, drones, robotics, and automotive sectors. RF360 provides a complete suite of filters and filter technologies, including Surface Acoustic Wave (SAW), Temperature Compensated Surface Acoustic Wave (TC-SAW), and Bulk Acoustic Wave (BAW) solutions, supporting various frequency bands in global networks.
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